2.1. Specifications¶
2.1.1. Compute¶
FEATURE |
DESCRIPTION |
---|---|
CPU |
NXP i.MX8M Plus QuadLite/Quad [1] Core 1.8 GHz ARM® Cortex®-A53 + ARM® Cortex®-M7 800 MHz Real-time Co-processor + AI/ML Neural Processing Unit (NPU) up to 2.3 TOPS |
GPU |
Vivante GC7000UL; 16 GFLOPS (high-precision) OpenGL® ES 3.1/3.0, Vulkan®, Open CL™ 1.2 FP, OpenVG™ 1.1; Video Decode: 1080p60, h.265/4, VP9, VP8; Video Encode: 1080p60, h.265/4; DVI-D output up to 1080p60 over HDMI connector |
AI Accelerator [1] |
Hailo-8 AI accelerator; TensorFlow, TensorFlow Lite, ONNX, Keras, PyTorch; up to 26 TOPS |
Memory |
1-8 [1] GB LPDDR4 DRAM |
Primary Storage |
16-128 [1] GB eMMC Flash |
Operating Systems |
Linux OS, Android, Windows 10 IoT Core, FreeRTOS |
TPM |
Optional TPM 2.0 (Infineon SLB9670) [1] |
RTC |
On-board real-time clock with coin cell battery |
2.1.2. Networking¶
FEATURE |
DESCRIPTION |
---|---|
Ethernet |
2x GbE RJ45 Ethernet; RJ45 connector; 1x 802.3af Type-1 PoE [1] |
Wi-Fi |
Intel 8265 Wi-Fi 5 (ac) Bluetooth 4.2 / Intel AX200/AX201/AX210/AX411 Wi-Fi 6/6E (ax) Bluetooth 5.3 / Nordic Semiconductor nRF52840 Bluetooth 5.3 with Wirepas Positioning [1] |
Location |
GPS/GLONASS/BeiDou/Galileo/QZSS [1] |
Cellular |
LTE (Cat. 4/M1/NB1/NB2)/3G/2G [1] |
Wirepas |
Nordic Semiconductor nRF52840 for Wirepas 2.4 GHz, Nordic Semiconductor nRF9161 for Wirepas DECT [1] |
2.1.3. Interfaces¶
FEATURE |
DESCRIPTION |
---|---|
Ethernet |
2x GbE RJ45 Ethernet; RJ45 connector; 1x 802.3af Type-1 PoE [1] |
LEDs |
2x general-purpose user-controlled LEDs |
USB |
1x USB 3.0 SuperSpeed Ports; 2x USB 2.0 High-Speed Ports; Type-A |
RS-232 Serial |
Up to 3x RS-232 ports [1] with galvanic isolation; Terminal Block |
RS-485 Serial |
Up to 3x half-duplex RS-485 ports [1] with galvanic isolation; Terminal Block |
CAN Bus |
Up to 2x CAN bus ports [1] with galvanic isolation; Terminal Block |
USB Serial |
USB 2.0 Debug/Console Serial Interface; USB Type-B Micro |
SIM |
1x Nano-SIM Card [1] |
Digital Input |
4x 24 V compliant inputs [1] with galvanic isolation; Terminal Block |
Digital Output |
4x 24 V compliant outputs [1] with galvanic isolation; Terminal Block |
M.2 Key-E |
M.2 Key-E Socket with PCIe 2.1 + USB 2.0 |
Mini-PCIe |
mPCIe Socket with USB 2.0 |
DVI-D |
DVI-Digital output over HDMI physical; up to 1080p60 |
Expansion Connector |
Proprietary connector for add-on boards: LVDS, SDIO, USB, SPI, I2C, GPIOs [1] |
Footnotes
2.1.4. Electrical¶
FEATURE |
MIN. |
TYP. |
MAX. |
UNIT |
---|---|---|---|---|
Supply Voltage |
8 |
12 |
36 |
V |
Supply Current |
450 @ 12 V |
650 @ 12 V |
mA |
|
Active Power |
5.4 |
7.8 |
W |
2.1.5. Mechanical & Environmental¶
FEATURE |
DESCRIPTION |
---|---|
Dimensions |
132 x 84 x 25 mm |
Enclosure Material |
Aluminium |
Weight |
550 g |
Operating Temperature |
Industrial: -40 °C to +85 °C |
Relative Humidity |
10% to 90% (operation); 5% to 95% (storage) |
Regulatory |
FCC, CE, UK CA; EMC EN 55032/5, EN 61000-6-3 |
Safety |
EN/UL/IEC 62368-1 |