2.1. Specifications¶
2.1.1. Compute¶
FEATURE |
DESCRIPTION |
|---|---|
CPU/GPU[1] |
Intel® Core i7-1185G7E Quad Core 1.8/2.8 GHz boost 4.4 GHz; Intel vPro® Platform; TDP 15/28 W + Intel® Iris® Xe Graphics 350 MHz burst 1.35 GHz |
CPU/GPU[1] |
Intel® Core i5-1145G7E Quad Core 1.5/2.6 GHz boost 4.1 GHz; Intel vPro® Platform; TDP 15/28 W + Intel® Iris® Xe Graphics burst 1.30 GHz |
CPU/GPU[1] |
Intel® Celeron 6305E Dual Core 1.8 GHz; TDP 15 W + Intel® UHD Graphics burst 1.25 GHz |
AI Accelerator[1] |
Hailo-8 AI accelerator; TensorFlow, TensorFlow Lite, ONNX, Keras, PyTorch; up to 26 TOPS |
Memory |
Up to 64[1] GB SO-DIMM DDR4 up to 3200 MT/s |
Primary Storage |
256-2048[1] GB PCIe Gen. 4 x4 NVMe/SATA 3 (M.2) |
Secondary Storage[1] |
256-2048 GB PCIe Gen. 3 x4 NVMe (M.2) |
Secondary Storage[1] |
256-2048 GB SATA (M.2) |
Secondary Storage[1] |
256-2048 GB SATA (2.5” for SSD/HDD) |
Operating Systems |
Windows 11 Pro, Windows 10 Pro, Windows 10 LTSC 2021 IoT Enterprise, Debian, Ubuntu, Fedora, Arch Linux, All Linux distributions with Linux Kernel 5.15+ |
TPM |
Intel® PTT + optional discrete TPM 2.0[1] |
RTC |
On-board real-time clock with coin cell battery |
2.1.2. Networking¶
FEATURE |
DESCRIPTION |
|---|---|
Ethernet |
2x GbE RJ45 Ethernet + optional 2x GbE RJ45 Ethernet[1] + optional 2x GbE RJ45 Ethernet with PoE source up to 15 W[1] |
SFP+[1] |
Optional 2x GbE SFP+ |
Wi-Fi |
Intel 8265 Wi-Fi 5 (ac) Bluetooth 4.2 / Intel AX200/AX201/AX210/AX411 Wi-Fi 6/6E (ax) Bluetooth 5.3 / Nordic Semiconductor nRF52840 Bluetooth 5.3 with Wirepas Positioning[1] |
Location |
GPS/GLONASS/BeiDou/Galileo/QZSS[1] |
Cellular |
5G SA/NSA Sub-6/mmWave, LTE (Cat. 4/12/16/18/M1/NB1/NB2), 3G, 2G[1] |
Wirepas |
Nordic Semiconductor nRF52840 for Wirepas 2.4 GHz, Nordic Semiconductor nRF9161 for Wirepas DECT[1] |
2.1.3. Interfaces¶
FEATURE |
DESCRIPTION |
|---|---|
Ethernet |
2x GbE RJ45 Ethernet + optional 2x GbE RJ45 Ethernet[1] + optional 2x GbE RJ45 Ethernet with PoE source up to 15 W[1] |
SFP+[1] |
Optional 2x GbE SFP+ |
USB |
2x USB 3.1 SuperSpeed Ports + 2x USB 2.0 ports + optional 4x USB 3.1 SuperSpeed ports + optional 4x USB 2.0 ports; Type-A |
RS-232 Serial[1] |
Up to 20x RS-232 serial ports; 9-pin DE-9 |
RS-485 Serial[1] |
Up to 20x RS-485 serial ports; 9-pin DE-9 |
CAN Bus[1] |
Up to 5x CAN bus ports with isolation; 9-pin DE-9 |
SIM |
2x μSIM Card (internal) + eSIM + up to 2x μSIM Card slots (external) for Mini-PCIe [1] |
Digital I/O[1] |
Up to 100x digital I/O with isolation; terminal block |
Mini-PCIe[1] |
Up to 2x Mini-PCIe sockets with PCIe 3.0 x1 + USB 2.0 with dedicated μSIM Card tray |
M.2 Key-E |
|
M.2 Key-B |
|
M.2 Key-M |
Up to 2x[1] M.2 Key-M sockets with PCIe 3.0 x4 + SATA 3 |
SO-DIMM |
2x SO-DIMM socket for DDR4 RAM |
HDMI |
2x HDMI 1.4b socket compatible up to 2160p30 |
DisplayPort |
2x Mini-DisplayPort 1.2 socket compatible up to 2160p60 |
2.1.4. Electrical¶
2.1.5. Mechanical & Environmental¶
FEATURE |
DESCRIPTION |
|---|---|
Dimensions |
200 x 200 x 35.3[1] [mm] |
Enclosure Material |
Aluminium |
Mounting |
VESA/DIN mounting options available |
Operating Temperature[1] |
Commercial: 0 °C to +45 °C; Industrial: -40 °C to 685 °C |
Relative Humidity |
5% to 95% (non-condensing) |
Regulatory |
FCC, CE, UK CA; EMC EN 55032/5, EN 61000-6-3 |
Footnotes